Bonding and stacking (or cold slumping) many silicon wafers on top of each other is a technology initially developed by cosine for a novel type of light weight X-ray lenses (see Silicon Pore Optics below). Our specialised fully automated stacking robots can elastically deform and directly bond tens of patterned silicon wafers with micro-meter accuracy on top of each other, creating many potential shapes and structures for applications such as X-Ray imaging and beyond.
The silicon plates can be coated, grooved, wedged and structured with many different patterns. The stacking robots have been developed in house and combine standard wafer industry technology with novel metrology solutions to achieve high yields at very high accuracy.
The Silicon Pore Optics consist of single crystal silicon mirrors to focus X-rays. Silicon Pore Optics use the fact that standard double sided polished silicon wafers from the semiconductor industry have excellent properties for making X-ray mirrors. By using standard industry tools, cosine can shape the best quality silicon wafers and process them to form mirror segments.
This technology breaks the traditional assumption that thinner mirrors have to result in less imaging quality. By making use of the inherent stiffness of porous structures, very thin mirrors can be produced in a solid structure.
A result is an amazingly large surface area at very low mass, very high accuracy and unparalelled cost-effectiveness.
cosine has developed a contactless method, based on the detection and analysis of scattered light, to efficiently measure particles of a few micrometers on highly reflective structured surfaces.
This high-yield technology developed to obtain space qualified bond strength and very high resolution, combines specialised light sources, line CCDs and dedicated image analysis to successfully measure large numbers of silicon substrates in high throughput stacking robots.
Our expertise includes energy sensing detectors in the X-ray to gamma ray range as well as the EP12, which is a very small back-end system capable of simultaneously managing the data of up to 6 sensors at once, including advanced measurements such as energy sensing. This allows for a combination of multiple different kinds of measurements to be taken simultaneously.